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Laser Scribing,
Drilling, Cutting
Clean Holes
Smooth Scribe Lines
Intricate Contours
Perfect Dimensions
P/M Industries can provide you
with laser cut substrates ready
to metalize.
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- Use holes for front-to-back connection or to hold pins.
- Print through-hole wrap-arounds with the economy of holes or slots shared between cells
- Scribe lines allow you to hold together an array of smaller circuits until after print, fire and population
- Hold together an array of round parts with break-away tabs
- Keep handling marks off the final part with snap-away borders
- Use alignment holes rather than substrate edges for precise front-to-back registration
- Improve consistency of printing registration with alignment flats on substrate border
- Print first, then come to us for laser cut features optically aligned to your printing
Capabilities:
- Laser scribed cells as small as 0.100"x0.100"
- Edge radii as small as 0.005"
- Laser cut feature placement ±0.002"
- Features cut as close together as the thickness of the substrate
- All kinds of technical ceramics can be laser cut; including Alumina, Beryllia, Aluminum Nitride and Zirconia
Laser Scribing and Drilling
Laser Cut Feature Options
Separation Techniques
Choose Your Fiducials Carefully
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Aluminum Nitride,
Laser Scribing, Drilling, Cutting,
Grinding, Lapping, Polishing,
Laser Resistor Trimming,
Ceramic Substrates,
Employment Opportunities,
Key Contacts
Microelectric Industry Resources
P/M Industries, 14305 SW Millikan Way, Beaverton OR 97005
(503) 641-4646 fax (503) 601-3210 webmaster@pmindustriesinc.com
Copyright ® 2010 PM Industries. All rights reserved.
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