Dicing should be your choice if your ceramic substrate requirement calls for a superior edge. Dicing is the most cost efficient method of cutting an edge suitable for wrap-around printing and passing PIND testing. Unlike laser processing, dicing induces no stress and renders a particle-free edge. For these reasons, the dicing can be used to make extremely narrow strips or small chips.

P/M Industries employs stable, heavy-duty, floor-based diamond saws that are capable of making highly accurate and very consistent cuts with the assistance of computer programmed steps and rotation. We use resin bonded blades to produce the finest quality cut possible, with a minimum of chipping, and to assure the tightest tolerance possible on saw kerf widths. We can dice parts mounted on adhesive tape and glass plates.