Grinding, Lapping, Polishing
Precise Thicknesses
Perfect Corners
Smooth Edges
Consistent Surfaces
Come to P/M Industries for all of your ceramic substrate dimensioning needs!
We can fulfill your requirements for:
- lapping substrate surfaces to a custom thickness or a precise
tolerance
- removal of reject printing in order to preserve your investment in the
ceramic
- sawed edges for low loss requirements
- rounded edges for wrap-around printing
- polished
surfaces for finer line widths, lower signal loss
or tighter impedance control
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Capabilities:
Lapped Surfaces:
Surface Finish: 7-25 micro inches (0.1778-0.635um)
Flatness: ±0.0005 inch per inch (5um/cm)
Thickness: ±0.0005” (±12.7 microns)
Part Size: as large as 4.5 ” x 4.5” (114.3mm x 114.3mm)
Polished Surfaces:
SurfaceFinish Flatness Thickness
Al2O3 < 1.0u” (0.0254um) 0.0005”/” (5.0um/cm) ±0.0005” (12.7um)
BeO < 3.0u” (0.0762um)
0.0005”/” (5.0um/cm) ±0.001” (25.4um)
AlN < 2.0u” (0.0508um)
0.0005”/” (5.0um/cm) ±0.001” (25.4um)
Sawed Edges:
substrates as thin as 0.008” (0.2032mm)
substrates as thick as 0.180” (4.572mm)
substrates as large as 5” x 5” (127mm x 127mm)
final part sizes as small as 0.040” x 0.040” (1.016mm x 1.016mm)
a variety of ceramic materials can be cut, including BeO
standard kerf widths of 0.006” (0.1524mm), 0.010” (0.254mm),
0.020” (0.508mm).
(Other sizes are available upon request.)
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